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Manual Double-Sided Polishing Machine 'EF-08M'

Simultaneous grinding on both sides increases grinding time even further! Equipped with a clamping mechanism, it also supports heavy cutting and PCD.

The "EF-08M" is a manual double-sided grinding machine that achieves stable grinding precision due to its high rigidity and high accuracy. Simultaneous grinding of both sides further increases grinding time efficiency. It features a clamping mechanism that accommodates heavy cutting and PCD as well. Please feel free to contact us when you need assistance. 【Specifications (excerpt)】 ■ Target Workpieces - Saw diameter: φ150 to φ700mm - Plate thickness: 2.0 to 5.0mm ■ Grinding Method…Wet grinding (simultaneous oscillation grinding of both sides) - Grinding wheel: Diamond wheel *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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